What's your application - MEMS


Dicing to singulate MEMS structures on wafers and ceramics, high precision cutting and drilling of materials to produce MEMS components.

Process Targets

Developing the best techniques to dice multi-layer & multi-material structures, avoiding damage to sensitive surface topography and coatings, protection of delicate MEMS structures & bonding pads, minimising energy dissipation within the structures.


There are two options for you to pursue MEMS dicing and processing. Firstly, Loadpoint manufacture a number of machine systems so you can perform the work at your premise. Secondly, Loadpoint offer a sub-contract dicing service whereby you send us your material and specifications and we will dice and return the work for you.


MicroAce 66: 6” / 155mm dia. x 13mm work area, 2”, 3” and 4” blade capacity

NanoAce 200: 8” / 200mm dia. X 13mm work area, 2”, 3” and 4” blade capacity

NanoAce 300: 12” / 300mm dia. x 13mm work area, 2” and 3” blade capacity

NanoAce 450: 18” x12” / 450x300mm x 10mm work area, 2” and 3” blade capacity

For post-dice cleaning: Washpoint

For preparation of tape rings / hoop rings: Presspoint

Loadpoint Production

Loadpoint’s production facility for dicing, cutting, drilling, grinding & prototyping

Click on the following links for information on our in-house production capabilities for MEMS dicing and processing:

Wafer and substrate dicing

Core drilling & micro-drilling

Micro grinding