Dicing and backgrinding tapes

Fast delivery, high performance.

Loadpoint tapes have been selected and sourced from leading global tape manufacturers. These tapes are used by some of the largest, highest volumes semiconductor manufacturers who demand stringent quality product to get the best, consistent results out of their wafer processes.

Product Series Description Structure Product Code Applications
Base (µm) Adhesive (µm)
6033/6034
Datasheet
General purpose, Non-UV, PVC base film with acrylic adhesive 75 10 6033 - Low Tack

6034 - Low/Medium Tack
General purpose wafer dicing applications, low cost alternative to 6000 Series
5000 Series
Datasheet
Green layering tape, polyester base film with silicone/rubber adhesive 40 20 1040 - 20 Applied directly to the back of the substrate to create additional dicing depth
6000 Series
Datasheet
Semiconductor grade, non UV dicing tape, PVC base film with acrylic adhesive 80
or
100
10 6080 - 10

6100 - 10
General cleanroom wafer applications
7000 Series
Datasheet
UV Dicing tape, PVC base film with acrylic adhesive 80
or
100
10 7080 - 10

7100 - 10
General cleanroom wafer applications
8000 Series
Datasheet
UV Dicing tape, Polyolefin base film with acrylic adhesive 80
or
150
20
or
30
8080 - 20

8150 - 30
Balance between quality and performance, post-dice matrix expansion
9000 Series
Datasheet
UV Dicing tape, PET base film with acrylic adhesive 100
or
188
25
or
30
9100 - 25

9188 - 30
Highest specification, for applications demanding the best accuracy and quality of cut
*Please quote product code, tape width (mm) and roll length (m) for any tape enquires*