Micro grinding

What is Microgrinding?

The microgrinding technique uses a dicing saw in grinding mode, fitted with a thicker blade e.g. 5mm resin bond. The blade traverses the substrate without lifting the Z carriage.

Materials & components processed

Microgrinding is commonly used for reducing the dimensional thickness of a substrate. This technique is used for producing target resonant frequencies of sonar and ultrasound arrays.

Ceramics, PZT composites, metals.


Machine type Grinding tolerance Max / Min substrate depths
6” MicroAces <15µm 100µm – 20mm
8” NanoAces // //
12” NanoAces // //
MacroAce* <15µm 1mm – 50mm

*Suitable for thicker substrates such as ceramics & metals

For details of dicing blades commonly held in stock click here

For details of available work holdings & packaging methods click here