Dicing Applications

Silicon wafers

Applications

Wafer dicing to singulate die such as computer processors, chips, other etched devices

Process targets

Process and blade optimisation to ensure the highest productivity and lowest cost without sacrificing cut quality, continuous improvement of work holding materials and chucks to minimise top and bottom surface chipping, protection of special coatings or fine MEMS structures, maintaining accurate cutting tolerances to keep within the streets.

Options

There are two options for you to pursue wafer dicing. Firstly, Loadpoint manufacture a number of machine systems so you can perform the work at your premises. Secondly, Loadpoint offers a dicing solutions and processing service whereby you send us your material and specifications and we will dice and return the work for you.

Photonics, optics and glass

Applications

Photonics – dicing to singulate optical components such as LEDs, photodiodes and photosensors
Optics – Optic fibre and associated component cutting, optical lenses and windows
Glass – cutting of encoders, glass scales, chrome masks

Process targets

Dicing: Process and blade optimisation to ensure the highest productivity and lowest cost without sacrificing cut quality, optimisation of work holding materials & chucks to minimise top and bottom surface chipping, protection of special optical coatings & masks whilst dicing, verticality of cuts, maintaining precision for angled cuts.

Post-dice cleaning & handling: Ensuring the materials are free of contamination from dicing tapes & wax, developing the best cleaning process to maximise productivity and cleanliness, protecting the materials whilst cleaning, developing systems and packaging to guarantee protection during the next work process or off-site transportation.

Options

There are two options for you to pursue photonics, optics and glass dicing. Firstly, Loadpoint manufacture a number of machine systems so you can perform the work at your premises. Secondly, Loadpoint offer a dicing solutions whereby you send us your material and specifications and we will dice and return the work for you.

MEMS

Applications

Dicing to singulate MEMS structures on wafers and ceramics, high precision cutting and drilling of materials to produce MEMS components.

Process targets

Developing the best techniques to dice multi-layer and multi-material structures, avoiding damage to sensitive surface topography and coatings, protection of delicate MEMS structures and bonding pads, minimising energy dissipation within the structures.

Options

There are two options for you to pursue MEMS dicing and processing. Firstly, Loadpoint manufacture a number of machine systems so you can perform the work at your premises. Secondly, Loadpoint offer dicing solutions whereby you send us your material and specifications and we will dice and return the work for you.

PZT and PIEZO MATERIALS

Applications

Dicing of PZT and Piezo materials to produce sonar and ultrasound arrays, MEMs acutators, or multi-channel digital print heads.

Process targets

Optimising blade types and composition to produce accurate and repeatable kerfs (cut channels), process optimisation to ensure the highest productivity and lowest cost without sacrificing key objectives, protection of electronic contact layers during dicing.

Options

There are two options for you to pursue PZT and piezo materials dicing and processing. Firstly, Loadpoint manufacture a number of machine systems so you can perform the work at your premises. Secondly, Loadpoint offer dicing solutions service whereby you send us your material and specifications and we will dice and return the work for you.

SPECIALIST MATERIALS

Specialist materials are those that have been selected because of their specific physical or chemical properties. These properties could include their thermal expansion coefficients, their inertness, their thermal conductivity or their ability to withstand ultra-high temperatures. Such materials can be costly to produce which means material wastage from the cutting process needs to be minimised.

We have experience with cutting: various ceramics (96% alumina, Shapel Aluminum Nitride, Macor, Boron Nitride, Silicon Carbide), ferrous and non-ferrous alloys, Molybdenum & Iridium, graphite, composite multi-layer panels.

Applications of specialist materials include:

• Heat sinks for high power semiconductors
• Electrode contacts
• In vitro diagnostic medical devices
• Fuel cell technologies