Dicing Blades
Blades supplied by Loadpoint are available in a variety of dimensions, bond types and grit sizes
A selection of our main products available is given below
Please contact us with details of your application if you require a recommendation on a blade we need the following information. Material, material thickness, kerf width if available.
Fast delivery on stocked blades, and expedited services potentially available for longer lead time blades with a wide range to suit most dicing and cutting applications.
Resin Bonded, Hubless
Resin Bonded dicing blades are used in a wide variety of applications including glass, ceramics, crystalline materials, semiconductor packages & hard materials requiring high wear characteristics
Resin blades have excellent cutting ability that helps reduce chipping, fractures & achieve smooth surface finish. There are various concentrations, bonds & diamond types that make resin blade suitable for hard & soft materials
Specification
| Blade Type | Resin bond, Hubless |
| Grit Type/Size |
Diamond & Diamond coated depending on application 150, 180, 220, 240, 280, 320, 400, 500, 600 grit |
| Outer Diameter | 50-127mm |
| Thickness | 0.050 - 2.00mm |
| Inner Diameter | 40mm |
Electroformed, hubless
Electroformed blades are suitable for various cutting & grooving applications on a wide range of materials such as semiconductor wafers & compound wafers. nickel bonded blades can be used to make ultra thin blades where this application is required.
Specification
| Blade Type | Hubless |
| Grit Type/Size | 325 - 7000 Grit |
| Outer Diameter | 50 - 102mm |
| Thickness | 0.012-2.0mm |
| Inner Diameter | 40mm |
Applications
Silicon, GaAs, various semiconductor packages, electronic components & ceramics
Metal Bonded, hubless
The metal bond blade is made of powdered metal and produced through a sintering process. It is suitable for most applications aiming to keep edge shape & extend life.
It is compatible to process all kinds of electronic component materials including, package, glass, ceramics & magnetic material.
Specification
| Blade Type | Metal Bonded |
| Grit Type/Size |
170 - 3000 |
| Outer Diameter | 50 - 110mm |
| Thickness | 0.05 - 0.50mm |
| Inner Diameter | 40mm |
Applications
QFN, BGA, FR4/PCB, resin boards, composite materials, polymers and ceramics
Electroformed, hubbed
Hub-type electroformed blades are primarily designed for silicon semiconductor wafers & compound wafers. Hubbed blades are flexible to customers specifications & adjusted to suit. They can also handle ultra thin wafers & metallic film coated wafers.
| Blade Type | Hub |
| Grit Type / Size | 600-7000 |
| Outer Diameter | Various protrusion available |
| Thickness | 015-200µm |
Applications
Si, GaAs, SiGe, III-V, semiconductors, SiC, GaN
